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¢ñ¡¢Low-temperature Cured Silver Paste
¢ò¡¢Medium,High-temperature Sintered Silver Paste
¢ø¡¢Conductive Glue (Binder/Adhesive)

Medium, High-temperature Sintered Silver Paste


Silver Paster for NTC

Designation: NSP-9070 NSP-9070
Special Purpose: formation of NTC electrode
¢¡.Pastes Properties
1.Silver Contact:NSP-9070: 70¡À1%; NSP-9075:70¡À1%
2.Viscosity:NSP-9070: 40-60Kcps; NSP-9075: 1000-1500Kcps (4#Spindle; 25¡æ; 0.3r/min; NDJ-8S; shanghai)
3.Fineness: ¡Ü7¦Ìm
4.Coverage: NSP-9070: 130-150cm2/g; NSP-9075; 110-130cm2/g
¢¢.The Fired Film Properties
1.Condense film with metallic colour
2.Sheet Resistivity:¡Ü5m¦¸/¡õ(25¦Ìm)
3.Definition:SP-208-70 ¡Ü0.2mm
4.Solderability:2-3sec (dip seconds to attain 100%; coverage 2mmX2mm pads; Sn/62/Pb36/Ag2; 230¡æ
5.Solder Resistance:¡Ý5sec (Sn62/Pb36/Ag2; 230¡æ; rosin flux)
6.Adhesion: 1.2-1.5Kgf(90¡ã Peel; 2mmX2mm; §¶0.60mm wire: Sn62/Pb36/Ag2; 230¡æ; rosin flux)
¢£.Application Guidelines
1.Before use, fullily stirring or rolling
2.Dio or Screen:150-250mesh; optimum: 200mesh
3.Drying: SP-208-70; 150¡æ/3 min; SP-207-70; 30min at room tempreture then 150¡æ/3 min
4.Firing: peak temp: and time:850¡À10¡æ/10min; cycle: 60min
5.Thinner: ethylence glycol monobutyl ether or terpineol
6.Storage keep in a cool place away from heater or open flames, minimum shelf-life six months.


 
 

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