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¢ñ¡¢Low-temperature Cured Silver Paste
¢ò¡¢Medium,High-temperature Sintered Silver Paste
¢ø¡¢Conductive Glue (Binder/Adhesive)

Medium, High-temperature Sintered Silver Paste


  Silver Pastes for VFD

Designation: GSP-8070 GSP-8075
Special Purpose: formation of conductive netwouks for VFD
¢¡.Pastes Properties
1. Silver Contact: GSP-8070: 70¡À1% ; GSP-8075: 75¡À1%
2.Viscosity:1000-1500Kcps(4#Spindle; 25¡æ;0.3r/min; NDJ-8S; shanghai)
3.Fineness:¡Ü7¦Ìm
4.Coverage: GSP-8070; 110-130cm2/g; GSP-8075; 90-110cm2/g
¢¢.The Fired Film Properties
1.Condense film with metallic colour
2.Sheet Resistivity:¡Ü5m¦¸/¡õ(25¦Ìm)
3.Defination:¡Ü0.15mm
4.Solderability:dip seconds to attain 100% coverage (2mmX2mm pads: Sn62/Pb36/Ag2; 230¡æ)
5.Solder Resistance: ¡Ý5sec(Sn62/Pb36/Ag2; 230¡æ dipping)
6.Adhesion: 1.7-2.5kg(90 peel; 2mmX2mm pad;§¶0.06mm wire; Sn62/Pb36/Ag2 solder pretinned pads 230¡æ)
7.Stable with repeat firing, compatble with dielectrical layer
¢£.Application Guidelines
1.Screen Print:200-300mesh; optimum:250mesh
2.Drying:150¡æ/3min
3.Firing:peak temp.and time:580¡À10¡æ/10min; cycle: 60 min
4.Thinner:ethyiene glycol monobutyl ether or terpineol
5.Storage keep in a cool place away from heater or open flames, minimum shelf-life six months.


 
 

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