Designation: DSP-2258 DSP-2264
Special Purpose:formation of solderable and conductive film on the different substrates |
| ¢¡.Pastes Properties |
1.Silver Conten: DSP-2258: 58¡À1% DSP-2264: 64¡À1%
2.Viscosity: 10-20Kcps(2#Spindle; 25¡æ; 0.3r/min; NDJ-8S; shanghai)
3.Fineness:¡Ü7¦Ìm
4.Deposit Rate: 2mm/1hr
5.Coverage:1-2g/100cm2 |
| ¢¢.The Fired Film Properties |
1.Volume Resistivity: 2.0-6.0X ¦¸.cm or sheet resistivity¡Ü5m¦¸/¡õ(25¦Ìm)
2.Solderability: solder coverage >95% (Sn62/Pb36/Ag2 solder; dipping time 1-2sec; rosin flux: 215¡æ)
3.Solder Resistance:¡Ý5sec.(Sn62/Pb36/Ag2; 215¡æ; rosin flux)
4.Adhesion(shear strength):¡Ý20Kgf/cm2(steelXsteel) |
| ¢£.Application Guidelines |
1.Before use, stirring fully or rolling
2.Application: dipping
3.Drying: 30min at room temperature and 150¡æ/30min
4.Thinner:butyl acetate other or amyl acetate
5.Storage: keep in a cool place away from heater or open flames, minimum shelf-life six months. |
| Silver Pastes for Dipping |
Designation: DSP-2250
Special Purpose: formation of chip Ta-capacitor or conductive solderable film on different substrates |
| ¢¡.Pastes Properties |
1.Silver Content:50¡À1%
2.Viscosity: 10-20Kcps(4#Spindle; 25¡æ; 0.3r/min; NDJ-8S; shanghai)
3.Fineness:¡Ü7¦Ìm
4.Deposit Rate:¡Ü2mm/1hr
5.Coverage:1-2g/100cm2 |
| ¢¢.The Fired Film Properties |
1.High-elasticity, heat resistance(¡Ý350¡æ)
2.Volume Resistivity: 0.8-1.2X¦¸.cm or sheet resistivity¡Ü0.03¦¸/¡õ(25¦Ìm)
3.Adhesion(shear strength):25Kgf/cm2(steelXsteel)
4.Solderability: Sn/Pb coverage >95% (Sn62/Pb36/Ag2 solder; 215¡æ; without flux)
5.Solde-resistance:¡Ý5sec.(Sn62/Pb36/Ag2 solder;215¡æ) |
| ¢£.Application Guidelines |
1.Fully stirring or rolling before use
2.Application:dipping,spray or brush
3.Drying: after dipping 30min at room temperature and 150¡æ/30min
4.Thinner:butly acetate ether or amyl acetate
5.Storage:keep in a cool place away from heater or open flames, minimum shelf-life six months. |
