| SSP-2011 Silver Through-hole Printing Paste |
| Description |
SSP-2011 Silver Through-hole Printing Paste is designed for silver through hole, consists of very finely divided silver particles dispersed in a thermosetting resin. |
| Typical Applications |
Through-hole printing |
| Advantages |
Can be applied by manual or semi-automatic screen printing equipment.
Excellent screen residence time.
Very low sheet resistance (less than 0.035 ohm/square/25 um).
Excellent adhesion on plain and copper laminated substrates as used in the production of printed circuit boards.
Resistant to wave soldering and to commonly used peelable solder masks.
Resistant to those cleaning solvents commonly used in the printed circuit board industry. |
| Typical Properties(of wet product) |
| Pigment |
Silver / Silverplated copper |
| Binder |
thermosetting resin |
| Viscosity (Brookfield 20oC, 20 rpm) |
7,000-10,000 mPa.s
|
| Flashpoint (DIN 53213) |
75¡ãF |
| Solids content |
67-71% |
| Density |
2200kg/m3 |
Theoretical coverage
|
15m2/kg wet product at 10 um dry coating thickness |
| (m2/kg wet product at 10 um dry coating thickness) |
| Shelf life |
6 months when stored refrigerated |
| Method of Use |
| Screen printing |
|
| Equipment |
manual or semi-automatic printing equipment |
| Screen type |
monofilament-polyester and stainless steel: 40-60 T/HD (threads/cm) |
| Squeegee type |
polyurethane 60-75 Durometer |
| Emulsion thickness |
20 - 40 ¦Ìm direct emulsion when printing conductive jumpers; 50 -70¦Ìm capillary film for through-hole metallization |
| Stirring should be thorough, but not rapid as this causes air entrapment. |
| Blending and dilution |
The product is ready for use, but if necessary the product can be diluted with Acheson Diluent 3 (Arcosolv DPM) to the required viscosity. |
| Drying / curing schedule |
30 min./70¡ãF + 30 min./150¡ãF
|
| SSP-2011 is a STH-ink which can be applied by screen printing through 40-70T polyester screens or equivalent metal screens. The product should be thoroughly homogenised before printing. After printing, the prints can be dried/cured immediately at the given schedule. Optimum air circulation especially during the pre-drying step will improve the final performance of the STH connections. |
| Clean-up solvents |
MEK, MIBK or similar solvents. |
| Typical Properties |
| Sheet resistance |
0.026 ohm /sq./25um |
| Hole resistance (full hole) |
28 mohm/hole |
| Adhesion (ASTM 3359) |
5B to FR4 and copper |
| Storage |
at temperatures between 4 and 8oC. |
| Health & Safety |
See separate Material Safety Data Sheet. |
| SSP-2011 STH Paste Environmental Test Date |
| The following is an example of the environmental test data result for SSP-2011 STH paste recently conducted by one of our customers. |
| Test Items |
Test Conditions |
Specifications |
Result |
| Boiling Water Test |
{(100¡ãF x 2hours) + leave 22hours} x 4 cycles |
Hole resistance variation:
less than 100% |
Passed
+19.7% |
| Hot Oil Test |
{(260¡ãF x 10 sec.) + (room temp. x 10 sec.)} x 100 cycles |
Hole resistance variation:
less than 100% |
Passed
+39.2% |
| Solder Dip Test |
(260 +/- 5)¡ãF x 5 sec. xdipping 5 times |
Hole resistance variation:
less than 100% |
Passed
+30% |
| Thermal Shock Test |
{(125¡ãF x 30 min.) + room temp. 5 min. + (-55¡ãF x 30 min.)} x 100 cycles |
Hole resistance variation:
less than 100% |
Passed
+44.8% |
| Humidity, Solder Resistance Test |
40¡ãF x 95% RH x 96hours + room temp. within 1 hour + (260 +/- 5)¡ãF x 5 sec. x dipping 5 times |
Hole resistance variation:
less than 100% |
Passed
Max. +44.2% |
| Chemical Resistance Test |
Trichloroethane dipping 5 min. |
Hole resistance variation:
less than 100% |
Passed
+23.5% |
| Silver Migration Test |
40¡ãF x 95% RH x 40VDC x 1,000hours |
Hole Insulation Resistance:
more than 100Mohm
(between adjacent 2 holes) |
Passed |
