| SSP-2188 Silver polymer thick film ink |
| Description |
SSP-2188 Silver polymer thick film ink is highly conductive screen printable ink, consists of very finely divided silver particles dispersed in a thermosetting resin.It is specifically designed for use in the production of rigid printed circuit boards on substrates such as phenolic paper, epoxy paper and glass epoxy. |
| Typical Applications |
1) Through-hole printing 2) Conductive tracks, pads and jumpers |
| Advantages |
Can be applied by manual or semi-automatic screen printing equipment.
Excellent screen residence time.
Very low sheet resistance (less than 0.025 ohm/square/25 um).
Excellent adhesion on plain and copper laminated substrates as used in the production of printed circuit boards.
Resistant to wave soldering and to commonly used peelable solder masks.
Resistant to those cleaning solvents commonly used in the printed circuit board industry. |
| Typical Properties(of wet product) |
| Pigment |
silver |
| Binder |
thermosetting resin |
| 引火点 |
110oC |
| Viscosity (Brookfield 20oC, 20 rpm) |
29,000 - 35,000 mPa.s |
| Flashpoint (DIN 53213) |
110oC |
| Solids content |
76.0 - 80.0% |
| Density |
2680 kg/m3 |
Theoretical coverage
|
18 m2/kg wet product at 10 um dry coating thickness |
| (m2/kg wet product at 10 um dry coating thickness) |
| Shelf life |
at least 6 months under original seal |
| Method of Use |
| Screen printing
|
| Equipment |
manual or semi-automatic printing equipment |
| Screen type |
monofilament-polyester and stainless steel: 40-110 T/HD (threads/cm) |
| Squeegee type |
polyurethane 60-75 Durometer |
| Emulsion thickness |
50 -70μm capillary film for through-hole metallization |
| Stirring should be thorough, but not rapid as this causes air entrapment. |
| Blending and dilution |
SSP-3188 Silver polymer thick film ink is supplied ready-for-use and hence does not normally require dilution.The product should be thoroughly homogenized before printing Avoid rapid stirring as this causes air entrapment.Depending on the application, SSP-2188 Silver polymer thick film ink can be diluted with 1 - 10% by weight Appol’s Diluent 1 ("Carbitol" acetate). |
| Curing cycle |
Conductive tracks
SSP-2188 Silver polymer thick film ink coatings can be cured immediately after printing in conventional air circulated ovens at 140oC minimum or higher if the substrate allows, higher temperatures resulting in better characteristics.The minimum curing time is 30 minutes.
Optimum coating properties are achieved after pre-drying at 70oC or 15 minutes followed by curing at 150oC for 60 minutes.
Infrared curing can also be used successfully.
Through-hole printing
Optimum coating properties are achieved by drying at 60oC or 4 hours followed by final curing at 150oC.The minimum curing time is 30 minutes. |
| Clean-up solvents |
MEK, MIBK or similar solvents. |
| Typical Properties(as a cured coating on glass epoxy FR4 cured for 1 hour at 150oC) |
| Hole resistance (full hole) |
< 0.020ohm |
| Adhesion (ASTM 3359) |
excellent (5 B) |
| Storage |
at temperatures between 4 and 8oC. |
| Health & Safety |
See separate Material Safety Data Sheet. |
| Note |
The performance characteristics of SSP-2188 Silver polymer thick film ink are influenced by dilution ratio, printing technique, nature of substrate, curing temperatures, curing time and type of curing equipment.
For specific recommendations contact your local Appol’s representative |
