| SSP-1886 Silver paste (Low-temperature Curing) |
| Description |
SSP-1886 Silver paste (Low-temperature Curing)are a series of screen printable inks of silver paste, specifically designed for temperature-sensitive substrates. They are suitable for substrates such as PVC,PC,PI,PET,etc. |
| Typical Applications |
SSP-1886 can be printed and immediately baked for 30 minutes at 160oC (71¡éJ).Depending on the substrate and air flow, less time may be required to fully dry.SSP-1886 may be baked for 30 minutes at 200 oC(93oC) or 10 minutes at 250oC (121oC), but slightly higher electrical resistances may be produced.SSP-1886may also be cured by infrared. |
| Advantages |
*very low electrical resistance
* adjustable curing temperature for different temperature-sensitive substrates such as PVC,PI,PC,etc.
*excellent adhesion to flexible substrates
*semi-flexible
*good environmental resistance |
| Typical Properties(of wet product) |
| Pigment |
silver |
| Binder |
thermosetting resin |
| Viscosity (Brookfield 20oC, 20 rpm) |
15,000mPa.s |
| Flashpoint (DIN 53213) |
54¡æ |
| Solids content |
62% |
| Density |
2.13 kg/m3 |
Theoretical coverage
|
5.52 m2/kg (480 ft2/gal/mil) |
| (m2/kg wet product at 10 um dry coating thickness) |
| Shelf life |
12 months from date of qualification under original seal |
| Method of Use |
| Screen printing |
|
| Equipment |
manual or semi-automatic printing equipment |
| Screen type |
stainless steel: 100- 160 T/HD (threads/cm) |
| Squeegee type |
polyurethane 60-70 Durometer |
| Emulsion thickness |
20-40¦Ìm |
| Stirring should be thorough, but not rapid as this causes air entrapment. |
| Dilution |
Dilution would not normally be required, but in case it is, thin with 1 ¨C 5% by weight of butylcarbitol (butyldiglycol). |
| Applied dry coating thickness |
6¦Ìm-15¦Ìm |
| Curing cycle |
SP-1886 can be printed and immediately baked for 30 minutes at 160oC (71¡éJ).Depending on the substrate and air flow, less time may be required to fully dry.SSP-1886 may be baked for 30 minutes at 200 oC(93oC) or 10 minutes at 250oC (121oC), but slightly higher electrical resistances may be produced. Higher temperatures, if the substrate allows, result in better characteristics. Also infra-red curing can be used successfully. |
| Clean-up solvents |
MEK, MIBK or similar solvents. |
| Typical Properties(as a cured coating on glass epoxy FR4 cured for 1 hour at 150oC) |
| Sheet resistances |
< 15 milliohms per square ©ˆ1 mil |
| Adhesion (ASTM 3359) |
excellent (5 B) |
| Maximum service temperature |
150¡æ |
| Storage |
These products should be stored at temperatures between 5 and 25oC. |
| Health & Safety |
See separate Material Safety Data Sheet. |
